Technical Program Committee Members
Analog Circuits and Systems
Chair: Hidetoshi Onodera, Kyoto University
Yasuhiro Sugimoto, Chuo University
Tetsuya Hirose, Kobe University
Po-Chiun Huang, National Tsing Hua University
Li Geng, Xi'an Jiaoton University
Seung-Tak Ryu, KAIST
Yung-Chow Peng, TSMC
Sai-Weng Sin, University of Macau
Hao Yu, Nanyang Tech University
Li-Ren Huang, ITRI
Data Converters
Chair: SeongHwan Cho, KAIST
Yuichi Okuda, Renesas
Tai-Cheng Lee, National Taiwan University
Soon-Jyh Chang, National Cheng-Kung University
Takeshi Yoshida, Hiroshima University
Seng-Pan U, University of Macau
Jong-woo Lee, Samsung
Masaya Miyahara, Tokyo Institute of Technology
Shanthi Pavan, India Institute of Technology
Liyuan Liu, Chinese Academy of Sciences
Tsung-Heng Tsai, National Chung-Cheng University
Digital Circuits and Systems
Chair: Chen-Yi Lee, National Chiao Tung University
Liebo Liu, TsingHua University
Xiaoyang Zeng, Fudan University
Dajiang Zhou, Waseda University
Makoto Ikeda, University of Tokyo
Keiichi Kushida, Toshiba
Yong Lian (Peter), National University Singapore
Tay-Jyi Lin, Chung Cheng University
Volkan Kursun, HK UST
Byungsub Kim, Pohang University
Shu-Yu Hsu, Mediatek
Emerging Technologies and Applications
Chair: Woogeun Rhee, Tsinghua University
Shuohung Hsu, National Tsinghua University
Maryam Shojaei Baghini, Indian Institute of Technology (IIT)-Bombay
Jerald Yoo, Masdar Institute of Science and Technology
Shinichiro Mutoh, NTT
Noriyuki Miura, Kobe Univeristy
Pui-In Mak, University of Macau
Minkyu Je, Daegu Gyeongbuk Institute of Science and Technology (DGIST)
Youngcheol Chae, Yonsei University
Hidekuni Takao, Kagawa University
Nan Sun, Uinversity of Texas at Austin
Shuenn-Yuh Lee, National Cheng-Kung University
Memory
Chair: Kunwoo Park, Hynix Semiconductor Inc.
Atsushi Kawasumi, Toshiba Corporation
Sungdae Choi, Hynix Semiconductor Inc.
Katsuyuki Sato, TSMC
Kazuhiko Kajigaya, Elpida Memory Inc.
Meng-Fan (Marvin) Chang, National Tsing Hua University
Hiroyuki Yamauchi, Fukuoka Institute of Technology
Chun Shiah, Etron Technology Inc.
Junghwan Choi, Samsung Electronics
Ken Takeuchi, Chuo University
Jaydeep Kulkarni, Intel Corporation
Shyh-Shyuan Sheu, ITRI
Radio Frequency
Chair: Satoshi Tanaka, Murata
Huei Wang, National Taiwan University
Minoru Fujishima, Hiroshima University
Chien-Nan Kuo, National Chao Tung University
Baoyong Chi, Tsinghua University
Julien Ryckaert, IMEC / SSET
Chun Huat HENG, National University of Singapore
Tae Wook Kim, Yonsei University
Ting-Ping Liu, NOKIA
Sam Chun-Geik Tan, MEDIATEK
Jenny Yi-Chun Liu, National Tsing Hua University
SoC and Signal Processing
Chair: Kazutami Arimoto, Okayama Prefectural University
Byeong-Gyu Nam, Chungnam National University
Zhiyi Yu, Fudan University
Satoshi Shigematsu, NTT Microsystem Integration Laboratories
Robert Chen-Hao Chang, National Chung Hsing University
Sugako Otani, Renesas Electronics Corporation
Kyung Ki Kim, Daegu University
Yong Hei, Chinese Academy of Sciences
An-Yeu (Andy) Wu, National Taiwan University
Takeshi Kumaki, Ritsumeikan University
Chun-Ming Huang, National Chip Implementation Center (CIC)
Wireline and Mixed Signal Circuits
Chair: Hong June Park, POSTECH
Wei-Zen Chen, National Chiao Tung University
Jun Terada, NTT
Yongpan Liu, Tsinghua University
Jung-Hoon Chun, Sungkyunkwan University
Jongsun Kim, Hongik University
Che-Fu(Jeff) Liang, Mediatek
Bo Zhang, Broadcom
Yoshiyuki Ota, Renesas
Chao-Cheng Lee, Realtek
Industry
Chair: Toru Shimizu, Renesas Electronics
Stefan Rusu, Intel Corporation
Ron Ho, Oracle
Shiro Dosho, Panasonic
Daisaburo Takashima, Toshiba
ShaoJun Wei, Tsinghua University
Ting Wu, Norel Systems
Ma Fan Yung, Infineon
Hsiang-Hui Chang, MediaTek
